電機工程學系

Permanent URI for this communityhttp://rportal.lib.ntnu.edu.tw/handle/20.500.12235/85

歷史沿革

本系成立宗旨在整合電子、電機、資訊、控制等多學門之工程技術,以培養跨領域具系統整合能力之電機電子科技人才為目標,同時配合產業界需求、支援國家重點科技發展,以「系統晶片」、「多媒體與通訊」、與「智慧型控制與機器人」等三大領域為核心發展方向,期望藉由學術創新引領產業發展,全力培養能直接投入電機電子產業之高級技術人才,厚植本國科技產業之競爭實力。

本系肇始於民國92年籌設之「應用電子科技研究所」,經一年籌劃,於民國93年8月正式成立,開始招收碩士班研究生,以培養具備理論、實務能力之高階電機電子科技人才為目標。民國96年8月「應用電子科技學系」成立,招收學士班學生,同時間,系所合一為「應用電子科技學系」。民國103年8月更名為「電機工程學系」,民國107年電機工程學系博士班成立,完備從大學部到博士班之學制規模,進一步擴展與深化本系的教學與研究能量。

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    A 30-GHz Low-Phase-Noise 0.35-μm CMOS Push-Push Oscillator Using Micromachined Inductors
    (2006-06-16) To-Po Wang; Ren-Chieh Liu; Hong-Yeh Chang; Jeng-Han Tsai; Liang-Hung Lu; Huei Wang
    A low-phase-noise 0.35-mum CMOS push-push oscillator utilizing micromachined inductors is presented in this paper. With the micromachined high-Q inductors, the oscillator achieves an oscillating frequency of 30.9 GHz while exhibiting an output power of -4 dBm with a low phase noise of -102.3 dBc/Hz at 1-MHz offset and the figure of merit (FoM) of -171.4 dBc/Hz. The fundamental rejection is 30 dB. This oscillator achieves low phase noise, good FOM, high output power, and also demonstrates the highest operating frequency among previously published Si-based and GaAs-based VCOs using micromachined structures
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    MMICs in the millimeter-wave regime
    (IEEE Microwave Theory and Techniques Society, 2009-02-01) Huei Wang; Kun-You Lin; Zuo-Min Tsai; Liang-Hung Lu; Hsin-Chia Lu; Chi-Hsueh Wang; Jeng-Han Tsai; Tian-Wei Huang; Yi-Cheng Lin
    On the basis of the current status of silicon based MMICs, it is possible to implement millimeter-wave SOC in silicon-based technologies that include the antenna, a medium-power amplifier, a transceiver, an LO (frequency synthesizer), and baseband circuits in a single chip. With certain interconnection schemes, such as flip-chip, to connect the chip to the substrate, it is also possible to integrate the best possible chips for a millimeter-wave communication system. Currently, CMOS is the best choice for the baseband circuits, while GaAs and InP MMICs can provide the best noise/power performance in the transceiver. High-efficiency antennas can be implemented directly on the packaging substrate. The SIP approach has the optimal combinations of the components for the best performance in a particular system. For example, a system in a package including CMOS baseband circuits, GaAs/InP-based transceiver, high-efficiency antenna, and high-power amplifier can achieve the best system characteristics. As we have discussed, the scope of SOC can be expanded along with more advanced MMIC fabrication technology and design techniques.